Application
Polyimide films (thickness 0.025 mm) can be used in capacitors, flexible printing circuits boards, insulation materials, and also in optoelectronic applications, such as transparent conductive film, transparent substrates for flexible display, and flexible solar cells. It is also used for the fabrication of flexible copper-clad laminates (FCCLs) for advanced microelectronic assembly.
General description
Polyimides are an important class of high-temperature engineering polymers consist of aromatic dianhydrides and diamine monomers. These polymers are well known for their high-temperature stability, low-temperature tolerance, mechanical strength, chemical resistance, radiation resistance, and excellent dielectric properties.
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